发明名称 |
Microelectronic imagers and methods of packaging microelectronic imagers |
摘要 |
Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.
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申请公布号 |
US2005275048(A1) |
申请公布日期 |
2005.12.15 |
申请号 |
US20040867352 |
申请日期 |
2004.06.14 |
申请人 |
FARNWORTH WARREN M;RIGG SIDNEY B;HIATT WILLIAM M;KIRBY KYLE K;BENSON PETER A;WARK JAMES M;WOOD ALAN G;HEMBREE DAVID R;AKRAM SALMAN;WATKINS CHARLES M |
发明人 |
FARNWORTH WARREN M.;RIGG SIDNEY B.;HIATT WILLIAM M.;KIRBY KYLE K.;BENSON PETER A.;WARK JAMES M.;WOOD ALAN G.;HEMBREE DAVID R.;AKRAM SALMAN;WATKINS CHARLES M. |
分类号 |
H01L21/00;H01L23/02;H01L23/48;H01L27/14;H01L27/146;H01L31/00;H01L31/0203;H01L31/0232;(IPC1-7):H01L21/00;H01L31/023 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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