ASSEMBLY OF AN ELECTRICAL COMPONENT COMPRISING AN ELECTRICAL INSULATION FILM ON A SUBSTRATE AND METHOD FOR PRODUCING SAID ASSEMBLY

摘要

The invention relates to the assembly of an electrical component (3) on a substrate (2). At least one electrical insulation film (5) is provided to electrically insulate the component and at least one section (52) of the insulation film is connected to the component and the substrate, in such a way that the surface contours (51) of said section of the insulation film are moulded to the surface contours (11) formed by the component and the substrate. The assembly is characterised in that the insulation film (5) has a dielectric strength in relation to an electric field strength of more than 10 kV/mm and preferably more than 50 kV/mm. To produce the assembly, the insulation film is laminated onto the substrate, preferably by means of a vacuum. This ensures that the insulation film and the component are in extremely close contact. The component is in particular a power semiconductor component. The insulation film ensures that no electrical arcing takes place, despite the high electrical voltages used during the operation of components of this type, even on exposed parts of the component, i.e. corners or edges, in which field overshoots can occur.