| 摘要 |
<P>PROBLEM TO BE SOLVED: To facilitate the bonding and separation of a polishing pad in a CMP (Chemical Machinery Polishing) device. <P>SOLUTION: The chemical machinery polishing device is equipped with a platen 1 with a polishing pad 5 bonded thereto, and a wafer retaining mechanism 7 for rotating the platen while retaining the wafer so as to be pushed against the polishing pad. In the polishing pad bonding method wherein the polishing pad 5 is bonded to the platen 1, the polishing pad 5 is transparent, and an adhesive for bonding the polishing pad 5 to the platen 1 is an ultraviolet ray curing type adhesive. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
