| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of electronic component for surface mounting in which additional mounting can be surely realized without remarkable reduction in high density mounting, even when component mounting efficiency of a printed circuit board is lowered or when the components are mounted in the shape considerably different from the chip component already mounted. SOLUTION: A connection electrodes 4b, 4c are formed as the films to both ends of the component body 4a of a chip component 10 and a bonding member 7 is previously attached to the bottom surface of the component body 4a. On the upper surface of the connecting electrode 4b, one end of a strap line 8 is fixed with a connecting part 8a and one end of a strap line 9 is fixed with a connecting part 9a. When such chip component 10 is mounted, the component body 4a is tentatively fixed with the bonding member 7 to the part where a pattern for connection formed to the printed circuit board does not exist, and the front ends of the strap lines 8, 9 are electrically connected to the connection pattern. COPYRIGHT: (C)2006,JPO&NCIPI
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