摘要 |
A method for metallizing a non-metallic surface includes plating a basic metallic plating film on a non-metallic surface, plating a first metallic material on a surface of the basic metallic plating film to form an inner metallic layer, and plating a second metallic material on a surface of the inner metallic layer to form an outer metallic layer. Thus, the thin basic metallic plating film is previously plated on the non-metallic surface in a vacuum sputtering manner, so that the non-metallic surface is electrically conductive, thereby decreasing the working time of the later chemically or electrically plating steps, and thereby enhancing the productivity.
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