发明名称 Method for metallizing a non-metallic surface and the metallized surface structure thereof
摘要 A method for metallizing a non-metallic surface includes plating a basic metallic plating film on a non-metallic surface, plating a first metallic material on a surface of the basic metallic plating film to form an inner metallic layer, and plating a second metallic material on a surface of the inner metallic layer to form an outer metallic layer. Thus, the thin basic metallic plating film is previously plated on the non-metallic surface in a vacuum sputtering manner, so that the non-metallic surface is electrically conductive, thereby decreasing the working time of the later chemically or electrically plating steps, and thereby enhancing the productivity.
申请公布号 US2005276992(A1) 申请公布日期 2005.12.15
申请号 US20040864133 申请日期 2004.06.09
申请人 WU TUNG-HSIN 发明人 WU TUNG-HSIN
分类号 B05D7/00;B32B15/08;C23C14/00;C23C18/16;C23C28/02;C25D5/10;C25D5/54;(IPC1-7):B32B15/08 主分类号 B05D7/00
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