发明名称 |
Electronic unit with a substrate where an electronic circuit is fabricated |
摘要 |
In an electronic unit with a substrate, a control circuit is mounted on the substrate and is configured to execute an operation related to a load. A package encapsulates the control circuit and the substrate. The package has sides around a periphery of the substrate. At least one input terminal for input of a signal externally sent to the electronic unit is disposed on at least one of the plurality of surfaces. At least one output terminal for output of a control signal for controlling the load is disposed on at least another one of the plurality of surfaces. At least one check terminal for input/output of a signal for checking at least the control circuit is disposed on at least another one of the plurality of surfaces.
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申请公布号 |
US2005274982(A1) |
申请公布日期 |
2005.12.15 |
申请号 |
US20050151660 |
申请日期 |
2005.06.14 |
申请人 |
DENSO CORPORATION |
发明人 |
UEDA NOBUMASA;KASUYA HIROKAZU;NUMAZAKI KOJI;FUKUDA YUTAKA;SAITOU MITSUHIRO |
分类号 |
H01L23/34;H01L27/02;H01L29/861;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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