发明名称 Electronic unit with a substrate where an electronic circuit is fabricated
摘要 In an electronic unit with a substrate, a control circuit is mounted on the substrate and is configured to execute an operation related to a load. A package encapsulates the control circuit and the substrate. The package has sides around a periphery of the substrate. At least one input terminal for input of a signal externally sent to the electronic unit is disposed on at least one of the plurality of surfaces. At least one output terminal for output of a control signal for controlling the load is disposed on at least another one of the plurality of surfaces. At least one check terminal for input/output of a signal for checking at least the control circuit is disposed on at least another one of the plurality of surfaces.
申请公布号 US2005274982(A1) 申请公布日期 2005.12.15
申请号 US20050151660 申请日期 2005.06.14
申请人 DENSO CORPORATION 发明人 UEDA NOBUMASA;KASUYA HIROKAZU;NUMAZAKI KOJI;FUKUDA YUTAKA;SAITOU MITSUHIRO
分类号 H01L23/34;H01L27/02;H01L29/861;(IPC1-7):H01L23/34 主分类号 H01L23/34
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