METHOD FOR PRODUCING A PRINTED-CIRCUIT BOARD

摘要

The proposed method for producing a printed-circuit board consists in installing foil-coated plate between the inductor and the stencil and removing metallic coating at the surface areas of the plate by magnetic field generated by the inductor. The stencil is made of dielectric material with metallic coating at the areas that correspond to the conducting elements of the printed-circuit board. The thickness (d) of the stencil is defined according to the condition d/h << 1, where h is the thickness of the skin layer of the coating. The proposed method provides a possibility to decrease production cost and enhance productivity in manufacturing printed-circuit boards.