| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC module in which an IC chip included in it is prevented from being broken even when thickness of a molded part is made thin. <P>SOLUTION: In the IC modules (50 and 60) wherein each of the IC chips (1) is protected by molding the periphery of the IC chip (1), each of the IC chips (1) connected to a substrate (4) is arranged on a reinforcing plate (3), and a frame (6) surrounding the IC chip (1) is provided on the reinforcing plate (3), and the inside of the frame (6) is filled with a resin to form a molded part (9), and a cover (7) for covering the mold part (9) is provided on the frame (6). <P>COPYRIGHT: (C)2006,JPO&NCIPI |
