| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce a mounting region for semiconductor chips and a circuit board and improve the flexibility of signals and the wiring for a power supply. <P>SOLUTION: By providing a level difference not less than a fixed size in the direction perpendicular to the mounting surface between a plurality of die pads 2a and 2b, the semiconductor chips 3a, 3b and a circuit board 3c can be overlapped and mounted so that the mounting region for the semiconductor chips and the circuit board 3c can be reduced and the flexibility of wiring can be improved. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
