发明名称 MULTILAYER COIL AND METHOD FOR MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer coil which can be formed with a large number of turns at low cost and can be made short, and to provide a method for manufacturing the multilayer coil. <P>SOLUTION: The multilayer coil 100 is formed by wiring coils 2 in two rows and tow columns on a sheet material 11 having an adhesion layer on one surface and folding, piling up, and fixing the sheet material 11 by adhesion. In this case, four coils 2 are wired like one-stroke writing to have the same wiring direction when folded one over another. The adhesion layer folded inward and fixed in a folded state by interlayer adhesion without being exposed to the outside. The sheet material 11 is provided with a folding margin for folding and piling and further provided with a folding and piling-up positioning hole 12, an air discharge hole 13, and a cut 14 for folding and piling. The coils having been wired can be made multilayered only by folding and piling and fixation by the adhesion layer, and then the coil can be formed which is low-cost, short, and large in number of turns. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005347542(A) 申请公布日期 2005.12.15
申请号 JP20040165860 申请日期 2004.06.03
申请人 SONY CORP 发明人 KANNO MASAKI;MORI HIROYUKI;YAMADA SHINICHIRO;NOGUCHI TSUTOMU
分类号 H01F27/28;H01F5/00;H01F17/00;H01F30/00;H01F41/04;H01F41/12;(IPC1-7):H01F27/28 主分类号 H01F27/28
代理机构 代理人
主权项
地址