发明名称 |
Gap filling with a composite layer |
摘要 |
A method of filling a gap formed between adjacent raised surfaces on a substrate. In one embodiment the method comprises depositing a boron-doped silica glass (BSG) layer over the substrate to partially fill the gap using a thermal CVD process; exposing the BSG layer to a steam ambient at a temperature above the BSG layer's Eutectic temperature; removing an upper portion of the BSG layer by exposing the layer to a fluorine-containing etchant; and depositing an undoped silica glass (USG) layer over the BSG layer to fill the remainder of the gap.
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申请公布号 |
US2005277257(A1) |
申请公布日期 |
2005.12.15 |
申请号 |
US20040857829 |
申请日期 |
2004.06.01 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
BYUN JEONG S.;YUAN ZHENG;VENKATARAMAN SHANKAR;KARIM M. Z.;PHAM THANH N.;YIEH ELLIE Y. |
分类号 |
H01L21/76;H01L21/762;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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