Package and method for packaging an integrated circuit die

摘要

An integrated circuit assembly includes a lead frame having a plurality of leads with inner portions. A thermally-conductive clip member is bonded to the inner portions of the leads such that the clip member is electrically isolated from and yet thermally coupled to the lead frame. An integrated circuit die is bonded and thereby thermally coupled to the clip member. The die is electrically connected to the wire die by wire bonds. Encapsulant material is disposed over the inner portions of the leads and at least a portion of the clip member, and encapsulates the die and the wire bonds.