| 摘要 |
A heater chip for a micro-fluid ejection device having enhanced adhesion between a resistor layer and a protective layer. The heater chip includes a semiconductor substrate, a resistive layer deposited on the substrate, and a substantially non-conductive protective layer on the resistive layer. The protective layer is selected from a titanium-doped diamond-like carbon thin film layer, and a single thin film diamond-like carbon layer having at least a first surface comprised of more than about 30 atom % titanium. |
