发明名称 METHOD OF FORMING SIDEWALL SPACERS
摘要 The present invention allows the formation of sidewall spacers (217,218) adjacent a feature (206) on a substrate (201) without there being an undesirable erosion of the feature. The feature (206) is covered by one or more protective layers (220,207). A layer of a spacer material (211) is deposited over the feature (206) and etched anisotropically. An etchant used in the anisotropic etching is adapted to selectively remove the spacer material, whereas the one or more protective layers (220, 207) are substantially not affected by the etchant. Thus, the one or more protective layers (220, 207) protect the feature from being exposed to the etchant.
申请公布号 WO2005098929(A3) 申请公布日期 2005.12.15
申请号 WO2005US10475 申请日期 2005.03.29
申请人 ADVANCED MICRO DEVICES, INC.;LENSKI, MARKUS;GRAETSCH, FALK;REICHEL, CARSTEN;SCHWAN, CHRISTOPH;BIERSTEDT, HELMUT;KAMMLER, THORSTEN;MAZUR, MARTIN 发明人 LENSKI, MARKUS;GRAETSCH, FALK;REICHEL, CARSTEN;SCHWAN, CHRISTOPH;BIERSTEDT, HELMUT;KAMMLER, THORSTEN;MAZUR, MARTIN
分类号 H01L21/28;H01L21/336 主分类号 H01L21/28
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