| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a composition for forming a dielectric film which enables easy thickening of the film. <P>SOLUTION: The composition for forming the dielectric film contains (A) a particle having an ABOx type crystalline structure (wherein A is at least one metal species chosen from Li, Na, Ca, Sr, Ba and La; and B is at least one metal species chosen from Ti, Zr, Ta and Nb), (B) at least one metal compound, (C) at least one hydrophilic organic solvent and (D) an organic polymer. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
