| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device which has a multilayered wiring structure and is superior in heat dissipation, and to provide a manufacturing method of the device. <P>SOLUTION: In the circuit device 10, a wiring structure of a plurality of layers, which has a first conductive pattern 18A and a second conductive pattern 18B, is formed on the surface of a circuit board 16. A first insulating layer 17A is formed on the whole surface of the circuit board. The first conductive pattern 18A and the second conductive pattern 18B are insulated by a second insulating layer 17B. The amount of filler included in the second insulating layer 17B is less than that included in the first insulating layer 17A, and a size is smaller. Both conductive patterns are easily connected through the second insulating layer 17B. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
