MULTILAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate that packages a high-performance semiconductor chips. SOLUTION: In a multilayer wiring substrate having a first multilayer wiring structure 10 including first wirings 13 and 16 and first via wirings 12 and 15 formed on a first side where a semiconductor chip is packaged, and a second multilayer wiring structure 30 including second wirings 32 and 35 and second via wirings 34PG and 34S, the second wirings are formed to be thicker than the first wirings. COPYRIGHT: (C)2006,JPO&NCIPI