发明名称 PRIMER COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a primer composition sufficiently sticking a metal such as gold, silver and platinum which is believed difficult to bond, to a silicone rubber, providing firm bond and good bond durability (steam resistance), and effectively utilizable in a wide field such as electric and electronic parts. SOLUTION: A primer composition effective in integral molding of the silicone rubber and an adherend comprises a compound containing at least each one of an epoxy group, an Si-H group, and an aromatic ring per molecule, and a solvent. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005344107(A) 申请公布日期 2005.12.15
申请号 JP20050133975 申请日期 2005.05.02
申请人 SHIN ETSU CHEM CO LTD 发明人 YAMAKAWA NAOKI;MEGURIYA NORIYUKI
分类号 C09D163/00;C09D183/00;C09D183/02;C09D183/04;(IPC1-7):C09D163/00 主分类号 C09D163/00
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