发明名称 |
Electrical contacts in microelectromechanical devices with multiple substrates |
摘要 |
Disclosed herein a microelectromechanical device having first and second substrates that are bonded together with a gap formed therebetween. A plurality of functional members is disposed within the gap. The two substrates are bonded with a bonding agent that comprises an electrically conductive adhesive material.
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申请公布号 |
US2005275931(A1) |
申请公布日期 |
2005.12.15 |
申请号 |
US20050102082 |
申请日期 |
2005.04.08 |
申请人 |
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发明人 |
PATEL SATYADEV;RICHARDS PETER;DOAN JONATHAN;TARN TERRY |
分类号 |
G02B26/00;G02B26/08;(IPC1-7):G02B26/00 |
主分类号 |
G02B26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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