发明名称 Multi-layered structure including an epitaxial layer having a low dislocation defect density, semiconductor device comprising the same, and method of fabricating the semiconductor device
摘要 A multi-layered structure of a semiconductor device includes a substrate, and a heteroepitaxial layer having a low dislocation defect density on the substrate. The heteroepitaxial layer consists of a main epitaxial layer and at least one intermediate epitaxial layer sandwished in the main epitaxial layer. At their interface, the heteroepitaxial layer, i.e., the bottom portion of the main epitaxial layer, and the substrate have different lattice constants. Also, the intermediate epitaxial layer has a different lattice constant from that of the portions of the main epitaxial layer contiguous to the intermediate epitaxial layer. The intermediate epitaxial layer also has a thickness smaller than the net thickness of the main epitaxial layer such that the intermediate epitaxial layer absorbs the strain in the heteroepitaxial layer. Thus, it is possible to obtain a multi-layered structure comprising an epitaxial layer that is relatively thin and has a low dislocation defect density.
申请公布号 US2005274981(A1) 申请公布日期 2005.12.15
申请号 US20050194529 申请日期 2005.08.02
申请人 LEE HO;PARK MOON-HAN;RHEE HWA-SUNG;YOO JAE-YOON;LEE SEUNG-HWAN 发明人 LEE HO;PARK MOON-HAN;RHEE HWA-SUNG;YOO JAE-YOON;LEE SEUNG-HWAN
分类号 H01L21/20;H01L21/8238;H01L31/072;H01L31/117;(IPC1-7):H01L31/072;H01L21/823 主分类号 H01L21/20
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