| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a means for creating the best/optimal plan of production instructions in real time while associating the plan with changes in the states and/or conditions of facilities or lots to prevent production lots from being retained unnecessarily, for the process of machining thin films, typically those of semiconductors or liquid crystal that require large numbers of facilities and processes for production and that have a plurality of alternative facilities capable of processing in one process. <P>SOLUTION: An event receiving means 2 receives a state-change event 1. An event analysis means 3 conducts analysis to see if the event has been caused by lots or facilities. When it has been caused by lots, a technique A for determining the order of production instructions for cases where lots are the cause is used. When it has been caused by facilities, techniques B, C for determining the order of production instructions for cases where facilities are the cause are used to determine the order of production to create the best/optimal plan of production instructions. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
