| 摘要 |
PROBLEM TO BE SOLVED: To easily restrain a mounting failure caused by the warpage of a printed wiring board from occurring when electronic parts are mounted on the printed wiring board. SOLUTION: A frame-like region of a dummy board 13 which is obtained by removing copper patterns from the wiring board that forms the printed wiring board 10 so as to leave only resin unremoved behind is provided as wide as prescribed between a waste board 12 which is discarded by cutting after the electronic parts 20, 20, etc. are mounted on a product board 11 and the product board 11, whereby the region of the product board 11 can be made to expand comparatively freely by heating or shrink by cooling in a thermal treatment, and the region of the product board 11 is prevented from being warped much even if the region of the dummy board 13 is deformed. COPYRIGHT: (C)2006,JPO&NCIPI
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