发明名称 THIN FILM FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a forming method of a SiC<SB>x</SB>N<SB>y</SB>thin film for controlling (x) and (y) of three element composition SiC<SB>x</SB>N<SB>y</SB>of Si, C and N and safely forming it not only on a high melting point material but also on an organic compound without danger of explosion at a low temperature. SOLUTION: A gas inflow port is installed in a reaction chamber lower part, a substrate at an upper part and a tungsten catalyst object heated to 1,600°C in a middle part. Mixed gas of hexamethyldisilazane, ammonia, and hydrogen, which is introduced from the gas inflow port, is decomposed by the tungsten catalyst object. A recomposed chemical species reacts on a substrate surface and a SiC<SB>x</SB>N<SB>y</SB>thin film is formed. SiC<SB>x</SB>N<SB>y</SB>thin film composition is controllable by changing composition of mixed gas and a substrate temperature. The organic compound such as acrylic resin at a low melting point, which does not contain Si, teflon and polyester can be used as the substrate. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005347653(A) 申请公布日期 2005.12.15
申请号 JP20040167883 申请日期 2004.06.07
申请人 KYUSHU INSTITUTE OF TECHNOLOGY 发明人 IZUMI AKIRA;ODA AKISHI
分类号 C01B21/082;B01J23/30;C23C16/42;C23C16/44;H01L21/318;(IPC1-7):H01L21/318 主分类号 C01B21/082
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