| 摘要 |
PROBLEM TO BE SOLVED: To bond resin compounds on a die face and the non-mounting face of a circuit board at the time of resin-bonding a chip mounted on the mounting face of the circuit board. SOLUTION: A matrix type circuit board 1a having a through-hole 18 is constituted of a conventional circuit board 1p and a functional layer 27 formed on a non-mounting face 22. This functional layer 27 is provided with low adhesiveness for curing resin and proper adhesiveness to the non-mounting face 22. Thus, fluid resin or generated gas components are prevented from being bonded to the non-mounting face 22 by the functional layer 27 in a status that a metallic mold 6 is clamped. Also, when a resin burr 23 constituted of the curing resin is formed on the non-mounting face 22 side, the resin burr 23 is not bonded to the non-mounting face 22 though it is bonded to the functional layer 27. Therefore, the resin burr 23 is easily peeled from the functional layer 27, or easily peeled from the non-mounting face 22 with the functional layer 27 by a brush 29. COPYRIGHT: (C)2006,JPO&NCIPI
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