| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding method for the peripheral edge of a semiconductor wafer whereby the quality of the peripheral edge of the semiconductor wafer can be made high and its grinding time can be made short. SOLUTION: With respect to the grinding method for the peripheral edge of a semiconductor wafer, the grinding is so performed as to separate a grinding cloth from the wafer properly in the course of the process for grinding the peripheral edge of the wafer, by contacting pressingly the rotated grinding cloth with the peripheral edge of the rotated semiconductor wafer. COPYRIGHT: (C)2006,JPO&NCIPI
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