| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device configured to prevent the light outgoing region of a semiconductor laser array from being closed by solder materials. SOLUTION: This semiconductor laser device 100 is provided with a continuous semiconductor laser array 10 in which a plurality of light outputting regions 14 are arrayed with predetermined intervals on a longitudinal cleavage 10a; a continuous sub-mount 20 having a loading face 20b on which the semiconductor laser array 10 is loaded, and a light output side terminal face 20a on which the light outgoing region 14 side of the loaded semiconductor laser array 10 is positioned; and solder materials interposed between the loading face 20b of the sub-mount 20 and the lower electrode of the semiconductor laser array 10. The semiconductor laser array 10 is provided with an active layer 12 at a side close to the lower electrode 10b, the sub-mount 20 is provided with a chamfer section 22 at the corner parts of the loading face 20b and the light output side terminal face 20a, and the solder materials are interposed between the lower electrode 10b and the chamfer section 22. COPYRIGHT: (C)2006,JPO&NCIPI
|
