发明名称 SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATING THE SAME
摘要 <p>An interlayer insulation film (14) is formed to cover a dielectric capacitor and a contact hole (19) is so formed in the interlayer insulation film (14) as to reach an upper electrode (11a). An Al line (17) connected with the upper electrode (11a) through the contact hole (19) is formed on the interlayer insulation film (14). The contact hole (19) has an elliptical planar shape.</p>
申请公布号 WO2005119780(A1) 申请公布日期 2005.12.15
申请号 WO2004JP07817 申请日期 2004.06.04
申请人 FUJITSU LIMITED;NAGAI, KOUICHI 发明人 NAGAI, KOUICHI
分类号 H01L27/105;H01L21/02;H01L21/8246;H01L27/115;(IPC1-7):H01L27/105 主分类号 H01L27/105
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