| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a simpler manufacturing device of a MEMS (micro electronic mechanical system) device capable of improving a yield of the device by preventing damage of the device in practicing a process. <P>SOLUTION: This manufacturing method includes the process to prepare a semiconductor substrate 20 including a first semiconductor layer 21, a sacrifice layer 22 and a second semiconductor layer 23 by sequentially laminating them in manufacturing the MEMS device 10 furnished with a microscopic structural body 13 including a movable part 14 and a beam part 16, the process to form a clearance 50 and a recessed part 15 by etching an inside region of an inner peripheral frame region of the semiconductor substrate from the first semiconductor layer side and the second semiconductor layer side, the process to adhere a sheet shape member along a surface of a part of the second semiconductor layer of a region between inner peripheral frame regions of a plurality of chip regions and the chip regions, the process to dice a region between the chip regions from a surface of the first semiconductor layer and the process to form the microscopic structural body 13 by removing a part of the sacrifice layer exposed in the clearance and a part of the sacrifice layer exposed in the recessed part. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
