| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer transfer device wherein all wafers housed in a wafer cassette loaded in its hand at the same time, and which can improve the transfer efficiency of the wafer. SOLUTION: A wafer loading part 2 has a lamination structure of engineering plastic and metal. The wafer can be stably held by sucking through suction holes at three places. Thus, no notch is needed, and a clearance among the wafers becomes enough. The wafer loading part 2 can hold 25 pieces of wafers simultaneously, and a hand 1 and a robot arm 13 are connected or separated. COPYRIGHT: (C)2006,JPO&NCIPI |
