| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of components and increase the radiation efficiency of an IC driver and heat producing components without requiring a heat slinger. SOLUTION: In the radiation structure of the driver IC 2 for radiating the heat produced by the driver IC 2 mounted on a substrate 1 to a cabinet 3, a hole 1a is provided in the substrate 1 into which the driver IC 2 enters, and the driver IC 2 is mounted inside out in the hole 1a of the substrate 1. The substrate 1 is mounted in a state it is in contact with the cabinet 3, and a radiation paste 4 is applied between the driver IC 2 mounted on the substrate 1 and the cabinet 3 so that the heat produced by the driver IC 2 is radiated to the cabinet 3 via the radiation paste 4. COPYRIGHT: (C)2006,JPO&NCIPI
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