| 摘要 |
PROBLEM TO BE SOLVED: To permit the quality inspection of soldering for a multitude of terminals without requiring any big-scale inspection facility and without employing any special inspection standard when a BGA type or a CSP type electronic component is mounted on a substrate by soldering. SOLUTION: A wiring pattern for supplying a power supply to the electronic component and another wiring pattern for inputting an inspection starting signal into the electronic component are formed on the substrate, while an inspection mode deciding circuit 23 detects the input of the inspection starting signal from outside and decides an inspection mode. An output circuit 24 outputs a predetermined voltage with respect to respective terminals sequentially to respective terminals of objects of inspection, and, when an input circuit 25 detects the input voltage of the terminal when a predetermined voltage is outputted from respective terminals, then, an expected value deciding circuit 26 decides whether the input voltage detected by the input circuit 25 is the same as a voltage memorized in the expected value setting circuit 22 or not. The decided result can be seen by a monitor instrument. COPYRIGHT: (C)2006,JPO&NCIPI
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