| 摘要 |
A chip-component-mounted device comprises a print wiring board or lead frame, an electrically conductive adhesive and a chip component, said chip component being mounted on said print wiring board or lead frame through said electrically conductive adhesive, said chip component having a corner part, a ridgeline of said corner part facing a connected part side of said print wiring board or lead frame, an angle made by a face adjacent to said ridgeline and a face of said connected part being acute.
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