发明名称 |
ELECTRO-FORMED RING INTERCONNECTION SYSTEM |
摘要 |
<p>Multiple small conductive and flexible hollow rings (10), each of which is made from a pliable material, provide a flexible connection medium for use between a substrate (8) and a microelectronic device package (4). Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film (30) in which H-shaped cutouts (32) are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.</p> |
申请公布号 |
WO2005119850(A1) |
申请公布日期 |
2005.12.15 |
申请号 |
WO2005US18948 |
申请日期 |
2005.05.27 |
申请人 |
MOLEX INCORPORATED |
发明人 |
NODA, ATSUHITO;ICHIJO, YASUHIRO;HOSHIKAWA, SHIGEYUKI |
分类号 |
H01R4/02;H01R12/00;H01R13/24;H05K3/30;H05K3/34;(IPC1-7):H01R4/02 |
主分类号 |
H01R4/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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