发明名称 |
LIGHT EMITTING ELEMENT MOUNTING MEMBER, AND SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
The object of the present invention is to provide a light-emitting element mounting member and a semiconductor device using the same that is easy to process and that allows adequate heat dissipation. A light-emitting element mounting member 200 includes: a substrate 2 including an element mounting surface 2a mounting a semiconductor light-emitting element 1 and first and second conductive regions 21, 22 disposed on the element mounting surface 2a and connected to the semiconductor light-emitting element 1; a reflective member 6 including a reflective surface 6a defining an internal space 6b for housing the semiconductor light-emitting element 1 and containing a metal disposed on the element mounting surface 1a; and a metal layer 13 disposed on the reflective surface 6a. The reflective surface 6a is sloped relative to the element mounting surface 2a so that a diameter of the internal space 6b is greater away from the element mounting surface 2a. |
申请公布号 |
EP1605524(A1) |
申请公布日期 |
2005.12.14 |
申请号 |
EP20040720727 |
申请日期 |
2004.03.15 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
ISHIDU, SADAMU;HIGAKI, KENJIRO;ISHII, TAKASHI;TSUZUKI, YASUSHI |
分类号 |
H01L33/60;H01L33/62;H01L33/64;H01S5/00;H01S5/02;H01S5/022 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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