发明名称 LIGHT EMITTING ELEMENT MOUNTING MEMBER, AND SEMICONDUCTOR DEVICE USING THE SAME
摘要 The object of the present invention is to provide a light-emitting element mounting member and a semiconductor device using the same that is easy to process and that allows adequate heat dissipation. A light-emitting element mounting member 200 includes: a substrate 2 including an element mounting surface 2a mounting a semiconductor light-emitting element 1 and first and second conductive regions 21, 22 disposed on the element mounting surface 2a and connected to the semiconductor light-emitting element 1; a reflective member 6 including a reflective surface 6a defining an internal space 6b for housing the semiconductor light-emitting element 1 and containing a metal disposed on the element mounting surface 1a; and a metal layer 13 disposed on the reflective surface 6a. The reflective surface 6a is sloped relative to the element mounting surface 2a so that a diameter of the internal space 6b is greater away from the element mounting surface 2a.
申请公布号 EP1605524(A1) 申请公布日期 2005.12.14
申请号 EP20040720727 申请日期 2004.03.15
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 ISHIDU, SADAMU;HIGAKI, KENJIRO;ISHII, TAKASHI;TSUZUKI, YASUSHI
分类号 H01L33/60;H01L33/62;H01L33/64;H01S5/00;H01S5/02;H01S5/022 主分类号 H01L33/60
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