| 发明名称 |
SOLDERING PROCESS USING IMIDAZOLE COMPOUND |
| 摘要 |
<p>A water-based composition for treating copper or copper alloy surface for lead-free soldering, the composition comprising a compound represented by general formula (1):
<Chemistry id="chema01" num="0001"><Image id="ia01" he="67" wi="64" file="IMGA0001.TIF" imgContent="chem" imgFormat="TIFF" /></Chemistry> wherein R<Sup>1</Sup> is hydrogen or methyl, and either R<Sup>2</Sup> and R<Sup>3</Sup> represent chlorine and R<Sup>4</Sup> and R<Sup>5</Sup> represent hydrogen, or R<Sup>2</Sup> and R<Sup>3</Sup> represent hydrogen and R<Sup>4</Sup> and R<Sup>5</Sup> represent chlorine.</p> |
| 申请公布号 |
EP1605078(A1) |
申请公布日期 |
2005.12.14 |
| 申请号 |
EP20040721686 |
申请日期 |
2004.03.18 |
| 申请人 |
SHIKOKU CHEMICALS CORPORATION |
发明人 |
MURAI, TAKAYUKI;KIKUKAWA, YOSHIMASA;HIRAO, HIROHIKO |
| 分类号 |
C23C22/52;B23K35/36;C07D233/54;C07D233/64;C23F11/14;H05K3/28;(IPC1-7):C23C22/52;B23K1/20;B23K1/19 |
主分类号 |
C23C22/52 |
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