RESIN MOLDED PRODUCT FOR ELECTRIC PARTS AND MANUFACTURING METHOD THEREOF,申请号EP20030758786-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	RESIN MOLDED PRODUCT FOR ELECTRIC PARTS AND MANUFACTURING METHOD THEREOF
摘要
申请公布号	EP1555283(A4)	申请公布日期	2005.12.14
申请号	EP20030758786	申请日期	2003.10.22
申请人	FUJI ELECTRIC HOLDINGS CO., LTD.	发明人	KANNO, TOSHIYUKI;ONITSUKA, ASUKA
分类号	C08J3/20;C08J5/08;C08J7/00;C08K13/02;C08L101/00;(IPC1-7):C08K13/02	主分类号	C08J3/20
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Optical writing device, image forming apparatus, and method and program product for controlling optical writing device

System and method for labeling maps

Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same

Bipolar transistor structure and method including emitter-base interface impurity

Semiconductor photodetector and manufacturing method therefor

Memory and interconnect design in fine pitch

Light emitting device

Deceleration lens

Method and system for nuclear imaging using multi-zone detector architecture

Electromagnetic wave measuring apparatus, measuring method, program, and recording medium

PTC rod assembly and preheater incorporating the same

Media system and method of progressive musical instruction based on user proficiency

Lettuce cultivar 51-0703377-B

Aqueous phase oxidation process

Methods and apparatuses for producing ethylbenzene

Volatile cyclic siloxanes

Phenylpropionamide compounds and the use thereof

Method of manufacturing gel using polysaccharides as raw materials

Method for tap detection and for interacting with and a handheld electronic device, and a handheld electronic device configured therefor

Storage medium storing information processing program, information processing apparatus and information processing method