发明名称 Glass lid and package provided with such a lid for the encapsulation of electronic components
摘要 <p>The encapsulation lid (1) comprises at least two glass layers of different compositions, a first layer (2) called the bottom layer, which is continuous, and at least a second layer (3, 6), which is discontinuous and designed so as to define cavities (4, 5) or anfractuosities in this lid. Preferably, the glass layers other than the first layer are preferably formed from low-melting-point frits, thereby allowing such lids to be manufactured economically, without recourse to glass machining.</p>
申请公布号 EP1605530(A2) 申请公布日期 2005.12.14
申请号 EP20050104596 申请日期 2005.05.30
申请人 THOMSON LICENSING 发明人 BETTINELLI, ARMAND
分类号 H05B33/04;H01L51/10;H01L51/50;H01L51/52;(IPC1-7):H01L51/10 主分类号 H05B33/04
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