Transfer method for the manufacturing of electronic devices

摘要

The present invention is related to a method for the manufacture of an electronic device comprising the steps of:
a. releasably bonding a processable substrate to a face of a first carrier substrate (2) by means of a first bonding agent (4), thereby obtaining a first composite substrate;b. processing the processable substrate of the first composite substrate so as to manufacture an electronic device comprised on its surface; andc. releasing the processable substrate from the first carrier substrate (2) by a releasing agent (8);
whereby the face of the first carrier substrate comprises a pattern of trenches (3).