发明名称 Semiconductor device and method of fabricating the same
摘要 A semiconductor device includes (a) a semiconductor layer formed on an electrically insulating layer, (b) a gate insulating film formed on the semiconductor layer, (c) a gate electrode formed on the gate insulating film, and (d) a field insulating film formed on the semiconductor layer for defining a region in which a semiconductor device is to be fabricated. The semiconductor layer includes (a1) source and drain regions formed in the semiconductor layer around the gate electrode, the source and drain regions containing first electrically conductive type impurity, (a2) a body contact region formed in the semiconductor layer, the body contact region containing second electrically conductive type impurity, and (a3) a carrier path region formed in the semiconductor layer such that the carrier path region does not make contact with the source and drain regions, but makes contact with the body contact region, the carrier path region containing second electrically conductive type impurity.
申请公布号 US6975001(B2) 申请公布日期 2005.12.13
申请号 US20020163984 申请日期 2002.06.06
申请人 NEC CORPORATION 发明人 KOH RISHO;SAITO YUKISHIGE;LEE JONG-WOOK;TAKEMURA HISASHI
分类号 H01L21/28;H01L21/8238;H01L21/84;H01L27/08;H01L27/092;H01L27/12;H01L29/786;(IPC1-7):H01L27/01 主分类号 H01L21/28
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