发明名称 |
Construction for high density power module package |
摘要 |
A high-density power module package wherein the circuits and a part of chips of the power module are formed on respective substrates such that the circuit patterns are not influenced by the chips. Accordingly, the density of the circuit can be improved so as to save the required area of substrate and production cost. |
申请公布号 |
US6975513(B2) |
申请公布日期 |
2005.12.13 |
申请号 |
US20030437183 |
申请日期 |
2003.05.14 |
申请人 |
CYNTEC CO., LTD. |
发明人 |
CHEN DA-JUNG;LIAO CHIN-HSIUNG |
分类号 |
H01L23/373;H01L23/433;H01L23/495;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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