Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials

摘要

A composition including an amount of at least one vinyl terminated polymer; an amount of at least one cross-linker comprising a terminal Si-H unit; an amount of at least one thermally conductive first filler, and at least one thermally conductive second filler, wherein a melting point of the first filler is greater than the melting point of the second filler. An apparatus including a package configured to mate with a printed circuit board; a semiconductor device coupled to the package; a thermal element; and a curable thermal material disposed between the thermal element and the semiconductor device.