发明名称 PRINT CIRCUIT BOARD IMPROVING A SOLDER JOINT RELIABILITY AND SEMICONDUCTOR PACKAGE MODULE USING THE SAME
摘要 A printed circuit board and a semiconductor package module using the same in which solder joint reliability (SJR) is improved. The printed circuit board includes: a first terminal exposed to the external of the printed circuit board in a print circuit pattern to be connected to a solder ball of a semiconductor package; a second terminal exposed to the external of the printed circuit board in the printed circuit pattern to be connected to another printed circuit board; and a buffer layer, which is an insulating layer formed adjacent the first terminal, being formed of a thermal absorption material, e.g. an elastomer, configured to absorb thermal stress caused by any difference of coefficients of thermal expansion between the semiconductor package and the first terminal, wherein the printed circuit board is a multi-layered printed circuit board including alternately layered insulators and printed circuit patterns.
申请公布号 KR20050116704(A) 申请公布日期 2005.12.13
申请号 KR20040041854 申请日期 2004.06.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JEONG, SE YOUNG;OH, SE YONG
分类号 H01L23/12;H01L21/288;H01L21/44;H01L21/60;H01L23/32;H01L23/373;H01L23/485;H01L23/498;H01L23/50;H05K1/02;H05K1/11;H05K3/28;H05K3/34 主分类号 H01L23/12
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