Epoxy resin composition for encapsulation of semiconductor device,申请号KR20020087847-传众专利搜索

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发明名称	Epoxy resin composition for encapsulation of semiconductor device
摘要
申请公布号	KR100536094(B1)	申请公布日期	2005.12.12
申请号	KR20020087847	申请日期	2002.12.31
申请人		发明人
分类号	C08L63/00;(IPC1-7):C08L63/00	主分类号	C08L63/00
代理机构		代理人
主权项
地址

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