| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that, when a conventional semiconductor device or multi-chip module is removed after a semiconductor element is mounted to a substrate or after semiconductors are adhered to each other, the semiconductor may be given a large damage. SOLUTION: The semiconductor device or the multi-chip module is formed by connecting a substrate and a semiconductor element as well as connecting the semiconductor elements with each other through the engagement of a concave and a convex. The substrate and the semiconductor element, or the semiconductor elements can be electrically connected with each other by means of an exposed metallic portion provided respectively in the convex and the concave. Thus, the easily attachable/detachable semiconductor device and the multi-chip module can be obtained. COPYRIGHT: (C)2006,JPO&NCIPI
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