发明名称 METHOD FOR INSPECTING CONTINUITY OF WIRING CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for inspecting continuity of wiring circuit boards and capable of reliably executing continuity inspection while reducing unit prices of products and improving manufacturing efficiency. SOLUTION: Each terminal 18 of a substrate-side terminal part 7 formed at a rear end part of a suspension substrate 1 with a circuit is formed as a flying lead having its back surface exposed from a supporting substrate 2 and a base insulating layer 3 and its surface exposed from a cover insulating layer 5. Continuity inspection is executed with the surface as a terminal 13 for connection for connecting to a control circuit substrate and the back surface as a terminal 15 for continuity inspection for connecting to a probe 14 for inspection for continuity inspection. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005337811(A) 申请公布日期 2005.12.08
申请号 JP20040155108 申请日期 2004.05.25
申请人 NITTO DENKO CORP 发明人 KANEKAWA HITONORI;OSAWA TETSUYA
分类号 G01R31/02;H05K3/00;(IPC1-7):G01R31/02 主分类号 G01R31/02
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