发明名称 |
METHOD FOR INSPECTING CONTINUITY OF WIRING CIRCUIT BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for inspecting continuity of wiring circuit boards and capable of reliably executing continuity inspection while reducing unit prices of products and improving manufacturing efficiency. SOLUTION: Each terminal 18 of a substrate-side terminal part 7 formed at a rear end part of a suspension substrate 1 with a circuit is formed as a flying lead having its back surface exposed from a supporting substrate 2 and a base insulating layer 3 and its surface exposed from a cover insulating layer 5. Continuity inspection is executed with the surface as a terminal 13 for connection for connecting to a control circuit substrate and the back surface as a terminal 15 for continuity inspection for connecting to a probe 14 for inspection for continuity inspection. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2005337811(A) |
申请公布日期 |
2005.12.08 |
申请号 |
JP20040155108 |
申请日期 |
2004.05.25 |
申请人 |
NITTO DENKO CORP |
发明人 |
KANEKAWA HITONORI;OSAWA TETSUYA |
分类号 |
G01R31/02;H05K3/00;(IPC1-7):G01R31/02 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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