<p>A method for controlling the chemical composition of an electroplating bath solution used to plate a plurality of substrates by providing the electroplating bath solution to a small-volume plating cell configured to minimize additive breakdown, and discarding the electroplating bath after a predetermined bath lifetime. The method includes predetermining a lifetime of an electroplating bath solution having a desired chemical composition, combining a plurality of electroplating bath solution components thereby forming the electroplating bath solution having the desired chemical composition, filling a small-volume plating cell with the electroplating bath solution, plating a plurality of substrates in the electroplating bath solution until the bath lifetime is reached; and discarding the electroplating bath solution after the bath lifetime is reached.</p>
申请公布号
WO2005116303(A1)
申请公布日期
2005.12.08
申请号
WO2005US16123
申请日期
2005.05.06
申请人
APPLIED MATERIALS, INC.;ROSENFELD, ARON;HAFEZI, HOOMAN;SUN, ZHI-WEN;YANG, MICHAEL;BEHNKE, JOSEPH
发明人
ROSENFELD, ARON;HAFEZI, HOOMAN;SUN, ZHI-WEN;YANG, MICHAEL;BEHNKE, JOSEPH