发明名称 |
GAS-COOLED CLAMP FOR RAPID THERMAL PROCESSING |
摘要 |
The present invention is directed to a semiconductor thermal processing apparatus and a method for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a gas-cooled clamp and associated method is disclosed which provides cooling of a substrate by thermal conduction generally in the free molecular regime. The gas-cooled clamp comprises a clamping plate having a plurality of protrusions that define gaps therebetween, wherein a distance or depth of the gaps are associated with a mean free path of the cooling gas therein. The gas-cooled clamp further comprises a pressure control system operable to control a backside pressure of the cooling gas within the plurality of gaps to thus control a heat transfer coefficient of the cooling gas, wherein the heat transfer coefficient of the cooling gas is primarily a function of the pressure and substantially independent of the gap distance. |
申请公布号 |
KR20050115923(A) |
申请公布日期 |
2005.12.08 |
申请号 |
KR20057017740 |
申请日期 |
2005.09.22 |
申请人 |
AXCELIS TECHNOLOGIES, INC. |
发明人 |
KELLERMAN PETER;BENVENISTE VICTOR;CARLSON FREDERICK |
分类号 |
C23C16/458;H01L21/00;H01L21/687;(IPC1-7):H01L21/324 |
主分类号 |
C23C16/458 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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