发明名称 RAPID ADHERING POST CURING TYPE CURABLE COMPOSITION AND ITS PRODUCTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a new rapid adhering post cure type curable composition and its production method, which can be used in multi-purpose applications due to high speed processability, improved qualities of cured products and good influence upon surroundings with keeping high productivity of conventional reactive hot-melt adhesives and excellent processability of contact adhesives, more particularly, to provide a two-pack type rapid adhering post curing type curable composition and a reactive hot-melt curing composition, its production method, a curing method and a coating device. SOLUTION: The object can be attained by using the curable composition comprising a specific polymer, a specific reactive substance for synthesizing the polymer, a specific crosslinking agent, a specific catalyst for synthesizing a polymer and a specific crosslinking catalyst at a specific ratio, and can be attained by a novel production method comprising synthesizing directly the polymer, which is the main component of the curable composition, in a mixer in a coating device, and further, by accelerating curing by heating after adhesion. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005336451(A) 申请公布日期 2005.12.08
申请号 JP20040255094 申请日期 2004.09.02
申请人 OKAI HIROSHI 发明人 OKAI HIROSHI
分类号 C09K3/10;C08G18/69;C08K5/101;C08L75/04;C09D7/12;C09D123/22;C09D133/00;C09D175/04;C09J11/00;C09J123/22;C09J133/00;C09J175/04;(IPC1-7):C08L75/04 主分类号 C09K3/10
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