| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board, a processing method of the printed circuit board, and a manufacturing method of the printed circuit board, which provide improved mounting density on the printed circuit board, reduced production cost, and uniform processing quality. SOLUTION: In a printed circuit board in which conductor layers and insulating layers are alternately stacked, a covering layer that absorbs laser light but dissolves the conductor layers is provided on the surface of a conductor layer as a first layer F. In this case, the covering layer is preferably formed on the surface of the conductor layer at a back side. Moreover, it is preferable that a material of the conductor layer contains Cu as a main component, a main material of the covering layer is CuO, and the thickness of the covering layer is not less than 0.6μm. COPYRIGHT: (C)2006,JPO&NCIPI |
