| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator coping with downsizing and including an excellent vibration characteristic hardly affected by noise. SOLUTION: In the piezoelectric oscillator provided with: a vibrator package 50 for containing therein a piezoelectric vibration chip 51 and an external terminal part electrically connected to the piezoelectric vibration chip on a rear side 58; and a semiconductor element 40 incorporating an oscillation circuit and a plurality of terminals electrically connected to the oscillation circuit, inner lead parts 61a, 62a of lead frames are joined on the rear side 58 of the vibrator package, a face of a semiconductor element 40 with a plurality of terminals is arranged opposite to the rear side 58 of the vibrator package, a plurality of the terminals 42, 45 of the semiconductor element are electrically connected to the inner lead parts 61a, 62a and the external terminal part respectively via bumps 80 and molding by a resin 20 is applied at least between the rear side of the vibrator package and the side of the semiconductor element with a plurality of the terminals. COPYRIGHT: (C)2006,JPO&NCIPI
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